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preliminary technical data mixed-signal control processor with arm cortex-m4 and 16-bit adcs adsp-cm402f / cm403f/cm407f / cm408f / cm409f rev. prf information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without no tice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106 u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ? 2014 analog devices, inc. all rights reserved. system features up to 240 mhz arm cortex-m4 with floating-point unit 24-channel analog front end (afe) with 16-bit adcs 128k byte to 384k byte zero-wait-state l1 sram with 16k byte l1 cache up to 2m byte flash memory single 3.3 v power supply package options: 176-lead (24 mm 24 mm) lqfp package 120-lead (14 mm 14 mm) lqfp package 212-ball (19 mm 19 mm) bga package static memory controller (smc ) with asynchronous memory interface that supports 8-bit and 16-bit memories enhanced pwm units four 3 rd /4 th order sinc filters for glueless connection of sigma-delta modulators hardware-based harmonic analysis engine 10/100 ethernet mac full speed usb on-the-go (otg) two can (controller area network) 2.0b interfaces three uart ports two serial peripheral interface (spi-compatible) ports eight 32-bit general-purpose timers four encoder interfaces, 2 with frequency division analog front end two 16-bit sar adcs with up to 24 multiplexed inputs, supporting dual simultaneous co nversion in 380 ns (16-bit, no missing codes) adc controller (adcc) and dac controller (dacc) two 12-bit dacs two 2.5 v precision voltage reference outputs (for details, see adc/dac specifications on page 66 .) figure 1. block diagram up to 2m byte flash (executable) l1 cache 16k byte l1 instruction cache system control blocks peripherals hardware functions l3 memory system fabric 1 emac with ieee 1588 (optional) 2x sport 2 can static memory controller async interface 2 spi 4 quadrature encoder 8 timer 12 pwm pairs 1 twi / i 2 c usb fs otg (optional) l1 memory up to 384k byte parity-enabled zero-wait-state sram jtag, swd, coresight? trace event control system watchdogs pll & power management fault management 3 uart adcc dacc harmonic analysis engine (hae) analog front end gpio (40 or 91) 2 adc 2 dac sinc filters security cortex-m4
rev. prf | page 2 of 122 | august 2014 adsp-cm402f / cm403f/cm407f / cm408f / cm409f preliminary technical data table of contents general description ................................................. 3 analog front end ................................................. 4 arm cortex-m4 core ........................................... 6 embeddedice ...................................................... 7 processor infrastructure ......................................... 7 memory architecture ............................................ 8 system acceleration ............................................ 10 security features ................................................ 10 processor reliability features ................................. 10 additional processor peripherals ............................ 11 clock and power management ............................... 14 system debug .................................................... 16 development tools ............................................. 16 additional information ........................................ 16 related signal chains .......................................... 16 adsp-cm40xf detailed signal descriptions ................ 17 adsp-cm402f/adsp-cm403f 120-lead lqfp signal descriptions ............................................. 21 adsp-cm402f/adsp-cm403f general-purpose i/o multiplexing for 120-lead lqfp ....................... 26 adsp-cm407f/ADSP-CM408F 176-lead lqfp signal descriptions ............................................. 28 adsp-cm407f/ADSP-CM408F general-purpose i/o multiplexing for 176-lead lqfp ....................... 36 adsp-cm409f 212-ball bga signal descriptions ... ...... 39 adsp-cm409f general-purp ose i/o multiplexing for 212-ball bga ... .............................................. 47 adsp-cm40xf designer quick reference ................... 50 specifications ........................................................ 61 operating conditions ........................................... 61 electrical characteristics ....................................... 63 adc/dac specifications ...................................... 66 flash specifications .............................................. 72 absolute maximum ratings ................................... 73 esd sensitivity ................................................... 73 package information ............................................ 73 timing specifications ........................................... 74 processor test conditions ................................... 105 output drive currents ....................................... 105 environmental conditions .................................. 106 adsp-cm402f/adsp-cm403f 120-lead lqfp lead assignments ............................................. 108 adsp-cm407f/ADSP-CM408F 176-lead lqfp lead assignments ............................................. 111 adsp-cm409f 212-ball bg a ball assignments .. ........ 115 outline dimensions .............................................. 119 pre release products ............................................. 122 revision history 08/14revision pre to revision prf added adsp-cm409f model to adsp-cm40xf family prod- uct features ............................................................ 3 added package information in adsp-cm409f 212-ball bga signal descriptions ................................................. 39 added package information in adsp-cm409f general-pur- pose i/o multiplexing for 212-ball bga ...................... 47 updated specifications ............................................ 61 added package information in adsp-cm409f 212-ball bga ball assignments .................................................. 115 added 212-ball bga package dimensions in outline dimen- sions .................................................................. 119 added adsp-cm409f model in pre release products ... 122 preliminary technical data rev. prf | page 3 of 122 | august 2014 adsp-cm402f / cm403f/cm407f / cm408f / cm409f general description the adsp-cm40xf family of mixe d-signal control processors is based on the arm ? cortex-m4 tm processor core with floating- point unit operating at frequencies up to 240 mhz and integrat- ing up to 384kb of sram memory, 2mb of flash memory, accelerators and peripherals optimized for motor control and photo-voltaic (pv) inverter cont rol and an analog module con- sisting of two 16-bit sar-type adcs and two 12-bit dacs. the adsp-cm40xf family operates from a single voltage supply (vdd_ext/vdd_ana), generating its own internal voltage supplies using internal voltage re gulators and an external pass transistor. this family of mixed-signal cont rol processors offers low static power consumption and is produced with a low-power and low- voltage design methodology, delivering world class processor and adc performance with lower power consumption. by integrating a rich set of indu stry-leading system peripherals and memory (shown in table 1 ), the adsp-cm40xf mixed-sig- nal control processors are th e platform of choice for next-generation applications that require risc programmabil- ity, advanced communications and leading-edge signal processing in one integrated package. these applications span a wide array of markets including power/motor control, embed- ded industrial, instrumentation, medical and consumer. each adsp-cm40xf family memb er contains the following modules. ? 8 gp timers with pwm output ? 3-phase pwm units with up to 4 output pairs per unit ?2 can modules ? 1 two-wire interface (twi) module ?3 uarts ? 1 adc controller (adcc) to control on-chip adcs ? 1 dac controller (dacc) to control on-chip dacs ? 1 sinus cardinalis (sinc) filter ? 1 harmonic analysis engine (hae) ? 1 spi connected to in ternal spi flash memory ?1 watchdog timer unit ? 1 cyclic redundancy check (crc) table 1 provides the additional product features shown by model. table 1. adsp-cm40xf family product features generic adsp-cm402f adsp-cm403f ads p-cm407f ADSP-CM408F adsp-cm409f package 120-lead lqfp 176-lead lqfp 212-ball bga gpios 40 91 smc 16-bit asynchronous/5 addres s 16-bit asynchronous/24 address adc enob (no averaging) 11+ 13+ 11+ 13+ adc inputs 24 16 24 dac outputs 2 n/a 2 sports 3 half-sports 4 half-sports ethernet n/a 1 n/a n/a 1 n/a 1 usb n/a 1 1 n/a 1 1 1 external spi 1 2 hae 1 can 2 uart 3 feature set code efcefabdab a l1 sram (kb) 128 128 384 128 128 384 384 128 384 384 384 flash (kb) 512 256 2048 512 256 2048 2048 1024 2048 2048 2048 core clock (mhz) 150 100 240 150 100 240 240 150 240 240 240 model adsp-cm402bswz-ef adsp-cm402bswz-ff adsp-cm403bswz-cf adsp-cm403bswz-ef adsp-cm403bswz-ff adsp-cm407bswz-af adsp-cm407bswz-bf adsp-cm407bswz-df adsp-cm408bswz-af adsp-cm408bswz-bf adsp-cm409cbcz-af rev. prf | page 4 of 122 | august 2014 adsp-cm402f / cm403f/cm407f / cm408f / cm409f preliminary technical data analog front end the processors contain two adcs and two dacs. control of these data converters is simplified by a powerful on-chip ana- log-to-digital conversion cont roller (adcc) and a digital-to- analog conversion controller (dacc). the adcc and dacc are integrated seamlessly into th e software programming model, and they efficiently manage the configuration and real-time operation of the adcs and dacs. for technical details, see adc/dac specifications on page 66 . the adcc provides the mechanis m to precisely control execu- tion of timing and analog sampling events on the adcs. the adcc supports two-channel (one eachadc0, adc1) simul- taneous sampling of adc inputs with tbd ps time offset accuracy (aperture delay), and can deliver 16 channels of adc data to memory in 3 s. conversion data from the adcs may be either routed via dma to memory, or to a destination register via the processor. the adcc can be configured so that the two adcs sample and convert both analog inputs simultaneously or at different times and may be operated in asynchronous or syn- chronous modes. the best performance can be achieved in synchronous mode. likewise, the dacc interfaces to two dacs and has purpose of managing those dacs. conversion data to the dacs may be either routed from memory th rough dma, or from a source register via the processor. functional operation and programming for the adcc and dacc are described in detail in the adsp-cm40xf mixed-sig- nal control processor with ar m cortex-m4 and 16-bit adcs hardware reference . adc and dac features and performance specifications differ by processor model. simplified block diagrams of the adcc, dacc and the adcs and dacs are shown in figure 2 and figure 3 . considerations for best converter performance as with any high performance analog/digital circuit, to achieve best performance, good circuit design and board layout prac- tices should be followed. the power supply and its noise bypass (decoupling), ground return paths and pin connections, and analog/digital routing channel paths and signal shielding, are all of first-order consideration. for application hints of design best practice, see figure 4 and the adsp-cm40xf mixed-signal con- trol processor with arm cortex -m4 and 16-bit adcs hardware reference . figure 2. cm402f/cm403f/cm409f analog front end block diagram dac1 dac0 adc0 adc1_vin00 . . . adc1_vin01 adc1_vin02 adc1_vin11 dac1 adc0_vin00 . . . adc0_vin01 adc0_vin02 adc0_vin11 dac0 mux mux adcc dacc control control micro controller dma sram memory data vref1 vref0 refcap buf buf buf buf buf buf dac1_vout dac0_vout ~ ~ ~ adc1 buf buf band gap adc/dac local controller preliminary technical data rev. prf | page 5 of 122 | august 2014 adsp-cm402f / cm403f/cm407f / cm408f / cm409f figure 3. cm407f/cm408f analog subsystem block diagram figure 4. typical powe r supply configuration 1 1 for more information abou t the vreg circuit, see figure 9 , internal voltage regulator circuit. dac1 dac0 adc1 adc0 adc1_vin00 . . . adc1_vin01 adc1_vin02 adc1_vin07 dac1 adc0_vin00 . . . adc0_vin01 adc0_vin02 adc0_vin07 dac0 mux mux adcc dacc control control micro controller dma sram memory data vref1 vref0 refcap buf buf buf buf buf buf ~ ~ not pinned out buf buf band gap adc/dac local controller vdd_ext vdd_vreg vdd_int byp_d0 gnd vdd_ana0 gnd_ana0 byp_a0 vref0 gnd_vref0 refcap gnd_vref1 vref1 byp_a1 gnd_ana1 vdd_ana1 vreg circuit 1 gnd_ana 3.3v connected at one point gnd_dig plane gnd_ana plane gnd_dig gnd_ana2 gnd_ana3 vreg_base adsp-cm40xf 0.01f 0.1f 10f 10f 0.1f 10f 0.1f 10f 0.01f 0.1f 10f 10f 0.1f 10f all labeled capacitors are ceramic capacitors. all labeled 10f capacitors are low esr capacitors. rev. prf | page 6 of 122 | august 2014 adsp-cm402f / cm403f/cm407f / cm408f / cm409f preliminary technical data adc module the adc module contains two 16-bit, high speed, low power successive approximat ion register (sar) adcs, allowing for dual simultaneous sampling with each adc proceeded by a 12-channel multiplexer. see adc specifications on page 66 for detailed performance specifications. input multiplexers enable up to a combined 26 analog inpu t sources to the adcs (12 ana- log inputs plus 1 dac loopback input per adc). the voltage input range requiremen t for those analog inputs is from 0 v to 2.5 v. all analog in puts are of single-ended design. as with all single-ended inputs , signals from high impedance sources are the most difficult to control, and depending on the electrical environment, may requ ire an external buffer circuit for signal conditioning ( figure 5 ). an on-chip pre-buffer between the multiplexer and ad c reduces the need for addi- tional signal conditioning external to the processor. additionally, each adc has an on -chip 2.5 v reference that can be overdriven when an external voltage reference is preferred. dac module the dac is a 12-bit, low power, string dac design. the output of the dac is buffered, and can drive an r/c load to either ground or v dd_ana . see dac specifications on page 68 for detailed performance specifications. it should be noted that on some models of the processor, the dac outputs are not pinned out. however, these outputs are always available as one of the multiplexed inputs to the adcs. this feature may be useful for functional self-check of the converters. arm cortex-m4 core the arm cortex-m4, core shown in figure 6 , is a 32-bit reduced instruction set computer (risc). it uses 32-bit buses for instruction and data. the length of the data can be eight bits, 16 bits, or 32 bits. the length of the instruction word is 16 or 32 bits. the controller has the following features. figure 5. equivalent single -ended input (simplified) analog source v in0 vdd_ana external buffer c ext r ext adsp-cm40xf hold to adc track 9pf 85 v in1 v in2 v inx 1.5pf mux pre-buffer 1.5pf 1.5pf 1.5pf preliminary technical data rev. prf | page 7 of 122 | august 2014 adsp-cm402f / cm403f/cm407f / cm408f / cm409f cortex-m4 architecture ? thumb-2 isa technology ? dsp and simd extensions ? single cycle mac (up to 32 32 + 64 -> 64) ? hardware divide instructions ? single-precision fpu ? nvic interrupt controlle r (129 interrupts and 16 priorities) ? memory protection unit (mpu) ?full coresight tm debug, trace, breakpoints, watchpoints, and cross-triggers microarchitecture ? 3-stage pipeline with branch speculation ? low-latency interrupt processing with tail chaining configurable for ultra low power ? deep sleep mode, dynamic power management ? programmable clock generator unit embeddedice embeddedice ? provides integrated on-chip support for the core. the embeddedice module contains the breakpoint and watch-point registers that allow code to be halted for debugging purposes. these registers are cont rolled through the jtag test port. when a breakpoint or watchpoint is encountered, the processor halts and enters debug state. once in a debug state, the proces- sor registers can be inspected as well as the flash/ee, sram, and memory-mapped registers. processor infrastructure the following sections provide information on the primary infrastructure components of the adsp-cm40xf processors. dma controllers (ddes) the processor contains 17 peripheral dma channels plus two mdma streams. dde channel nu mbers 0C16 are for peripher- als and channels 17C20 are for mdma. system event controller (sec) the sec manages the enabling and routing of system fault sources through its integrat ed fault management unit. trigger routing unit (tru) the tru provides system-level sequence contro l without core intervention. the tru maps trigge r masters (generators of trig- gers) to trigger slaves (receivers of triggers). slave endpoints can be configured to respond to triggers in various ways. common applications enabled by the tru include: ? initiating the adc sampling periodically in each pwm period or based on external events ? automatically triggering the start of a dma sequence after a sequence from another dma channel completes ? software triggering ? synchronization of concurrent activities figure 6. cortex-m4 block diagram 1 9 , & 1 ( 6 7 ( ' 9 ( & |